OUR GOAL IS YOUR SUCCESS

List of Our services:​

• Photolithography using I-line stepper (100mm and 150mm wafers)

• E-beam lithography

• CAD Design

• PECVD oxide and nitride deposition at different temperatures

• ALD, high-K dielectric and TiN deposition

• Reactive Ion Etching (RIE) of Si, Ge, Si oxide, Si nitride, SiC and III-V materials

• Dry etching of metals (Nb, Al and TiW)

• ICP and DICP Si and Si oxide etching

• Reactive Ion Beam Etching

• Wet etching of Si, Ge, Al, Au,and other metals

• Dry and wet thermal oxidation

• Epitaxial growth of doped and undoped group IV materials (Si, SiGe, Ge and GeSn)

• PVD (sputtering and e-beam evaporation) of different metals (Au, Ni, Al, Ti, TiW, Nb, In, ... )

• Lift-off

• Wafer bonding and layer transfer

• CMP

• Wafer dicing (Plasma and mechanical)

• Wire bonding

• Plasma and wet surface treatment

• SEM, TEM and AFM

• Ellipsometry

• XRD

• Electrical characterization

• Photoluminescence and Raman Spectroscopy at different temperatures down to 8K

• High temperature electrical characterization

• ...